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Procedure

Step 1

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Set up your steciling stencilling station!You want to surround

  • Get the board that will be brought up and place on a flat surface.

  • Surround your board with other PCB’s

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  • or straight

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  • -edged objects to keep it in place.

    • Cover all corners of the PCB.

  • Tape down all the surrounding PCB’s to

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  • lock the position of the PCB down.

    • Make sure it is completely level with the table and securely fit.

Step 2

Place and align your stencil!

  • Place a piece of tape shorter than the width of the stencil and align the stencil with the PCB.

    • You will use the stencil with the tape as a lever to slot in, paste, and remove PCBs.

    • Tape can be found in the “EE Tools” drawer or others.

  • Make sure that your stencil doesn’t get bent or is already bowed.

    • You want it flush to the surface of your PCB so paste doesn’t get under it.

Step 3

Paste your stencil and PCB!

  • You can find the paste and applicator in the fridge at the front of the bay.

  • While holding/securing the stencil down, use your applicator to evenly cover the stencil.

    • This may take multiple runs with the applicator to get an even covering of the pads.

    • You may want to be careful with any QFN ICs (e.g. STM32s).

  • When you’re done, lift the stencil and remove your PCB with tweezers.

Common Mistakes

  • Not making the PCB enclosure tight enough (the board shifts while applying paste)

  • Applying too much solder paste to the stencil, causing it to seep under or cross onto other pads

  • Peeling off the stencil from the enclosure and bending the flat metal