Layout

Stackup & Board Layout

Thinking of using:

6 Layer Board: SIG - GND - PWR - SIG - GND - SIG

Advantages of this stackup:

• Each Signal layer has an adjacent ground plane

• Split power plane for high current handling & power distribution

• Extra signal layer - can route using stripline connections

Other Board Considerations:

• Weight of copper (1oz vs 2oz) - I’m thinking 1oz should be fine, especially given a dedicated power plane for higher current handling

• Most likely to be a double-sided board

• FETS + Power on outer signal layer closest to PWR

• MCU + Gate Driver on other

• Mounting pattern + board dimensions?

  • COTS module is 70mm x 30mm