2023-10-04 EE High Current Power Module Discussion

Owned by Taim Al-Dabbagh
Last updated: 2024-05-14 by R D
1 min read

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@Taim Al-Dabbagh

@Steven Wang

 

Discussion Points

  1. Using power pads over XT90s

    1. Confirmed using power pads, saves space

  2. RPP?

    1. No RPP since black/red wires dictate which pad it gets soldered on

  3. Size (30x30 or 30x60)

    1. Choose 30x60. 30x30 would be more challenging (half of components go on bottom side, some will be under inductor)

  4. 2-Layer vs 4-Layer

    1. 4-Layer, too much current for 2-Layer

  5. PCB Stackup

    1. Going with PWR-SIG/GND/GND/PWR

  6. Thermal Relief

    1. VIAs (lots of them!)

  7. Consider replacing shunt resistor with a 4-terminal shunt resistor

    1. Better temperature stability

    2. Lower Temperature Coefficient of Resistance (relative change of resistance per degree of temperature change)

 

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